Multi-stage HP-CP device
Achieving high precision in temperature accuracy: Simultaneous heating/cooling of multiple substrates within the same frame is possible.
【Features】 ■ Uniform heating and cooling of various substrates using hot plates and cold plates. ■ The hot plate can control a maximum substrate temperature of 150±3.0℃, and the cold plate can control a temperature of 23±1.0℃. ■ Proximity pins can be removed or replaced. ■ The hot plates and cold plates can achieve static electricity removal through our company's unique surface treatment.
- Company：クリーン・テクノロジー
- Price：Other
